Operator Name :Mr. Sandipan Paul
Operator Email :ssandy.paul@gmail.com
Operator Contact :8902408256
Reactive-ion etching (RIE) is an etching technology used in microfabrication. RIE is a type of dry etching which has different characteristics than wet etching. RIE uses chemically reactive plasma to remove material deposited on wafers. The plasma is generated under low pressure(vacuum) by an electromagnetic field. High-energy ions from the plasma attack the wafer surface and react with it.