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Plasma-enhanced chemical vapor deposition (PECVD) unit

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Operator Name :Mr. Sandipan Paul

Operator Email :ssandy.paul@gmail.com

Operator Contact :8902408256

PECVD is used to deposit thin films from a gas state (vapor) to a solid state on a substrate. Chemical reactions are involved in the process, which occur after creation of plasma of the reacting gases. The plasma is generally created by radio frequency (RF) (alternating current (AC)) frequency or direct current (DC) discharge between two electrodes, the space between which is filled with the reacting gases.